在电子设备中,晶振可以产生高度稳定的信号,使得我们电路板得以正常运作。但是晶振的频点、封装、电压、频差等参数太多、选型难?怎么办呢?
扬兴科技快速帮您选型,下面是介绍12mhz晶振型号及封装尺寸,帮您锁定晶振型号需求,工温、民温均可满足定制
01、无源晶振型号
插件晶振:HC-49US
封装尺寸:11.5 x 4.5 x 3.68mm
专属料号:X49SD12MMB2SC,X49SD12MPD2SI,X49SD12MQD2SC,X49SD12MSB2SC,X49SD12MSB2SI,X49SD12MSD2SC,X49SD12MSD2SCI,X49SD12MWC2SC
晶体谐振器:HC-49SMD
封装尺寸:11.4 x 4.8 x 3.8 mm
专属料号:X49SM12MOD2SC,X49SM12MRB2SC,X49SM12MRD2SC,X49SM12MSB2SC,X49SM12MSB2SI,X49SM12MSD2SC,X49SM12MSD2SI
晶体谐振器:49XSMD-迷你
封装尺寸:6.1x 4.0x 2.0mm
专属料号:X49XM12MSD2SC
晶体谐振器:YSX221SL
封装尺寸:2.5x2.0mm (2520)
专属料号:X252012MMB4SC,X252012MMB4SI,X252012MSB4SI
晶体谐振器:YSX321SL
封装尺寸:3.2x2.5mm (3225)
专属料号:X322512MLB4SI,X322512MMB4SC,X322512MMB4SI,X322512MOB4SI,X322512MPB4SC,X322512MPB4SI,X322512MRB4SI,X322512MSB4SI
车规级晶振:YSX321SC
封装尺寸:3.2x2.5mm (3225)
专属料号:XC322512MOB4SA
无源晶振:YSX531SL
封装尺寸:5.0x3.2mm (5032)
专属料号:X503212MQB4SI,X503212MRD4SC,X503212MSB4SI
陶瓷晶振:YSX530GA
封装尺寸:5.0x3.2mm (5032)
专属料号:X503212MKB2GI,X503212MSB2GI,X503212MSD2GC,X503212MSD2GI,X503212MSD2GF
爱普生晶振:FA-20H
封装尺寸:2.5x2.0mm (2520)
专属料号:Q24FA20H0068700
爱普生晶振:FA-238V
封装尺寸:3.2x2.5mm (3225)
专属料号:Q22FA23V0050100,Q22FA23V0041800
爱普生晶振:FA-238A
封装尺寸:3.2x2.5mm (3225)
专属料号:X1E000341031500
02、有源晶振型号
晶体振荡器:YSO110TR
封装尺寸:2.0x1.6mm (2016),2.5x2.0mm (2520),3.2x2.5mm (3225),5.0x3.2mm (5032),7.0x5.0mm (7050)
专属料号:OT201612MJBA4SL,OT252012MJBA4SL,OT322512MJBA4SL,OT503212MJBA4SL,OT705012MJBA4SL
宽电压晶振:YSO130HR
封装尺寸:5.0x3.2mm (5032),7.0x5.0mm (7050)
专属料号:OH503212MFBA4SL,OH705012MFBA4SL
有源晶振:SG-210STF
封装尺寸:2.5x2.0mm (2520)
专属料号:X1G004171001800
有源晶振:SG-310SCF
封装尺寸:3.2x2.5mm (3225)
专属料号:Q33310F70060700
石英晶振:SG5032CAN
封装尺寸:5.0x3.2mm (5032)
专属料号:X1G004451002800
贴片晶振:SG7050CAN/CCN
封装尺寸:7.0x5.0mm (7050)
专属料号:X1G004481000600,X1G004501002112
03、石英可编程晶振型号
石英可编程晶振:YSO680PR
封装尺寸:2.5x2.0mm (2520),3.2x2.5mm (3225),7.0x5.0mm (7050)
专属料号:OP252012MEDA4SI,OP322512MEDA4SI,OP705012MEDA4SI
可编程石英晶振:YSO690PR
封装尺寸:3.2x2.5mm (3225),7.0x5.0mm (7050)
专属料号:O9705012MADA4SI,O9322512MEDA4SI
贴片晶振:SG-8018CE/SG-8018CA
封装尺寸:3.2x2.5mm (3225),7.0x5.0mm (7050)
专属料号:SG-8018CE 12MHZ TJHPA,SG-8018CA 12MHZ TJHPA
04、MEMS晶振型号
硅振:YSO8008MR-低功耗晶振
封装尺寸:2.0x1.6mm (2016),2.5x2.0mm (2520),3.2x2.5mm (3225),5.0x3.2mm (5032),7.0x5.0mm (7050)
专属料号:O252012MADS4MI,O322512MADH4MI,O705012MADH4MI,O322512MKDH4MI,O322512MBDH4MI,O201612MEDH4MI,O252012MEDF4MI,O252012MEDH4MI,O252012MEDS4MI,O322512MEDF4MI,O322512MEDH4MI,O322512MEDS4MI,O705012MEDH4MI
低抖动晶振:YSO8208MR
封装尺寸:5.0x3.2mm (5032)
专属料号:O503212MEDH4MI
高温晶振:YSO8920MR
封装尺寸:3.2x2.5mm (3225),5.0x3.2mm (5032)
专属料号:O322512MEDF4MG,O503212MEDF4MG
低功耗晶振:SIT8008
封装尺寸:3.2x2.5mm (3225),7.0x5.0mm (7050)
专属料号:SIT8008BI-22-33E-12.000000D,SIT8008BI-32-33E-12.000000Y,SIT8008BI-32-18E-12.000000Y
低功耗晶振:SIT1602
封装尺寸:5.0x3.2mm (5032)
专属料号:SIT1602AI-32-33E-12.000000Y
以上是小扬整理的常用12mhz晶振产品系列,详细产品规格书可直接在YXC官网私聊客服小姐姐获取!也可以让客服小姐姐按排业务与您对接,快速帮您的方案匹配选型。
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